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Xinxintian Industrial Zone, Shajing Street,Bao'an District, Shenzhen, China
BGA vs QFP vs QFP
With the rapid development of electronic technology, chip packaging technology, as the core link connecting semiconductor devices and circuit…
An guide for hybrid proce from SMT
Assembly Technology: An guide for hybrid processes from SMT Abstract :PCB assembly technology is undergoing revolutionary changes, with the…
High-speed PCB and back drilling technology
High-speed PCB design and back drilling technology: the core solution for signal integrity Abstract In the fields of 5G…
4 types poor SMT Assembly analysis
Full analysis of poor SMT welding: 4 types of defect causes and high-precision manufacturing solutions Abstract: In the field…
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