{"id":3960,"date":"2025-07-05T16:55:33","date_gmt":"2025-07-05T08:55:33","guid":{"rendered":"https:\/\/sevenpcba.com\/?p=3960"},"modified":"2025-07-05T16:55:36","modified_gmt":"2025-07-05T08:55:36","slug":"how-to-apply-solder-paste-and-whats-factors-affecting-solder-paste-printing-quality","status":"publish","type":"post","link":"https:\/\/sevenpcba.com\/it\/how-to-apply-solder-paste-and-whats-factors-affecting-solder-paste-printing-quality\/","title":{"rendered":"Come applicare la pasta saldante e quali sono i fattori che influenzano la qualit\u00e0 di stampa della pasta saldante?"},"content":{"rendered":"<h1 class=\"wp-block-heading\" id=\"just-how-to-publish-solder-paste-on-motherboard-and-factors-affecting-solder-paste-printing-quality\">Introduzione<\/h1>\n\n\n\n<p class=\"wp-block-paragraph\">In the field of digital production, solder paste printing is the core web link of surface place modern technology (SMT). This short article systematically evaluates the principle of solder paste printing procedure, equipment category and quality control points, and provides practical recommendation for digital manufacturing experts. Via scientific evaluation of printing parameters and process specifications, it aids companies boost welding reliability and lower problem rates.<\/p>\n\n\n\n<div class=\"wp-block-rank-math-toc-block\" id=\"rank-math-toc\"><h2>Sommario<\/h2><nav><ul><li><a href=\"#h2-concepts-and-core-features-of-solder-paste-printing-procedure\">Concepts and core features of solder paste printing procedure<\/a><ul><li><a href=\"#qualities-and-functions-of-solder-paste-products\">Qualities and functions of solder paste products<\/a><\/li><li><a href=\"#system-of-stencil\">System of Stencil<\/a><\/li><\/ul><\/li><li><a href=\"#h2-comparative-evaluation-of-3-sorts-of-solder-paste-printing-devices\">Comparative evaluation of 3 sorts of solder paste printing devices<\/a><\/li><li><a href=\"#h2-the-impact-of-scrape-criteria-on-printing-top-quality\">The impact of scrape criteria on printing top quality<\/a><ul><li><a href=\"#the-gold-proportion-of-scrape-angle-and-pressure\">The gold proportion of scrape angle and pressure<\/a><\/li><li><a href=\"#scraper-speed-control-strategy\">Scraper speed control strategy<\/a><\/li><\/ul><\/li><li><a href=\"#h2-steel-plate-upkeep-and-cleansing-specifications-\">Steel plate upkeep and cleansing specifications.<\/a><ul><li><a href=\"#cleansing-frequency-control-standard-\">Cleansing frequency control standard.<\/a><\/li><li><a href=\"#contrast-of-cleansing-techniques-\">Contrast of cleansing techniques.<\/a><\/li><\/ul><\/li><li><a href=\"#h2-influence-of-environmental-control-on-printing-high-quality-\">Influence of environmental control on printing high quality.<\/a><ul><li><a href=\"#temperature-and-humidity-control-criteria-\">Temperature and humidity control criteria.<\/a><\/li><li><a href=\"#vibration-suppression-steps-\">Vibration suppression steps.<\/a><\/li><\/ul><\/li><li><a href=\"#h2-analysis-and-services-for-usual-issues-\">Analysis and services for usual issues.<\/a><\/li><li><a href=\"#h2-key-modern-technologies-for-steel-plate-opening-up-layout-\">Key modern technologies for steel plate opening up layout.<\/a><ul><li><a href=\"#opening-up-form-optimization-\">Opening up form optimization.<\/a><\/li><li><a href=\"#opening-size-computation-formula-\">Opening size computation formula.<\/a><\/li><\/ul><\/li><li><a href=\"#h2-solder-paste-detection-modern-technology-prior-to-reflow-soldering-\">Solder paste detection modern technology prior to reflow soldering.<\/a><ul><li><a href=\"#3d-spi-discovery-parameters-\">3D SPI discovery parameters.<\/a><\/li><li><a href=\"#online-detection-system-arrangement\">Online detection system arrangement<\/a><\/li><\/ul><\/li><li><a href=\"#h2-expense-control-and-performance-enhancement-approach\">Expense control and performance enhancement approach<\/a><ul><li><a href=\"#tools-financial-investment-return-evaluation\">Tools financial investment return evaluation<\/a><\/li><li><a href=\"#process-optimization-suggestions\">Process optimization suggestions<\/a><\/li><\/ul><\/li><li><a href=\"#h2-sector-advancement-patterns-and-technical-technology-\">Sector advancement patterns and technical technology.<\/a><ul><li><a href=\"#application-of-brand-new-materials-\">Application of brand-new materials.<\/a><\/li><li><a href=\"#digital-change\">Digital change<\/a><\/li><\/ul><\/li><li><a href=\"#faq\">Domande frequenti<\/a><ul><li><a href=\"#faq-question-1751704853374\">Just how to determine whether the solder paste is void?<\/a><\/li><li><a href=\"#faq-question-1751704854251\">Exactly how to discover scrape wear?\u00a0<\/a><\/li><li><a href=\"#faq-question-1751704854986\">Which parameter should be adjusted first when printing is bad?<\/a><\/li><li><a href=\"#faq-question-1751704855787\">Just how to select the density of the steel plate?<\/a><\/li><li><a href=\"#faq-question-1751704856523\">What is the function of the vacuum adsorption workbench?<\/a><\/li><li><a href=\"#faq-question-1751704859107\">Why do you require to pre-heat after solder paste printing?\u00a0<\/a><\/li><\/ul><\/li><li><a href=\"#conclusion\">Conclusione<\/a><\/li><\/ul><\/nav><\/div>\n\n\n\n<figure class=\"wp-block-image size-full\"><img fetchpriority=\"high\" decoding=\"async\" width=\"960\" height=\"640\" src=\"https:\/\/sevenpcba.com\/wp-content\/uploads\/2025\/07\/3D-SPI-VS-2D-SPI-.jpg\" alt=\"\" class=\"wp-image-3962\" srcset=\"https:\/\/sevenpcba.com\/wp-content\/uploads\/2025\/07\/3D-SPI-VS-2D-SPI-.jpg 960w, https:\/\/sevenpcba.com\/wp-content\/uploads\/2025\/07\/3D-SPI-VS-2D-SPI--768x512.jpg 768w, https:\/\/sevenpcba.com\/wp-content\/uploads\/2025\/07\/3D-SPI-VS-2D-SPI--18x12.jpg 18w\" sizes=\"(max-width: 960px) 100vw, 960px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"h2-concepts-and-core-features-of-solder-paste-printing-procedure\">Concepts and core features of solder paste printing procedure<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"qualities-and-functions-of-solder-paste-products\">Qualities and functions of solder paste products<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Solder paste is made up of&nbsp;<strong>alloy powder&nbsp;<\/strong>(Sn96.5 Ag3.0 Cu0.5, etc) and&nbsp;<strong>change&nbsp;<\/strong>. Its viscoelastic residential or commercial properties allow it to be securely attached to the circuit board pads and thaw to form a dependable connection during high-temperature reflow soldering. This material building establishes that it has the twin features of&nbsp;<strong>temporary fixation&nbsp;<\/strong>E&nbsp;<strong>permanent welding&nbsp;<\/strong>in the SMT process.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"system-of-stencil\">System of Stencil<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">The pattern opening design follows the&nbsp;<strong>1:1 area ratio principle&nbsp;<\/strong>, and the solder paste transfer performance is made certain to reach more than 90% by specifically regulating the opening size (usually 85% -95% of the pad dimension). Modern laser-cut stencils can attain a placing accuracy of \u00b1 5\u03bcm, satisfying the printing demands of 0.3 mm pitch parts.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"h2-comparative-evaluation-of-3-sorts-of-solder-paste-printing-devices\">Comparative evaluation of 3 sorts of solder paste printing devices<\/h2>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Devices type<\/th><th>Accuracy (\u03bcm)<\/th><th>Suitable circumstances<\/th><th>Yearly upkeep expense (USD)<\/th><\/tr><\/thead><tbody><tr><td>Fully automated printer<\/td><td>\u00b1 20<\/td><td>Automazione<\/td><td>$20,000-$ 30,000<\/td><\/tr><tr><td>Semi-automatic printer<\/td><td>\u00b1 50<\/td><td>Trial production\/small batch manufacturing<\/td><td>$5,000-$ 8,000<\/td><\/tr><tr><td>Handbook printer<\/td><td>\u00b1 150<\/td><td>Prototype development\/education situation<\/td><td>$500-$ 1,500<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Completely automated printer&nbsp;<\/strong>takes on servo motor drive system and 3D optical discovery component to achieve the production capability of 500-800 motherboard per hour.&nbsp;<strong>Semi-automatic devices&nbsp;<\/strong>uses a robot arm to finish the positioning procedure, which is suitable for tiny set production of several selections.&nbsp;<strong>Manual printing&nbsp;<\/strong>Although the expense is reduced, the operator needs to have at the very least 3 years of experience to stably produce competent items.<\/p>\n\n\n\n<div class=\"wp-block-buttons is-content-justification-center is-layout-flex wp-container-core-buttons-is-layout-fe0a7de2 wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button\"><a class=\"wp-block-button__link wp-element-button\" href=\"https:\/\/sevenpcba.com\/it\/contact\/\">Richiedi subito un preventivo gratuito per l&#039;assemblaggio di PCB <\/a><\/div>\n<\/div>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"h2-the-impact-of-scrape-criteria-on-printing-top-quality\">The impact of scrape criteria on printing top quality<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"the-gold-proportion-of-scrape-angle-and-pressure\">The gold proportion of scrape angle and pressure<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">The scrape angle of 45 \u00b0 -60 \u00b0 combined with the get in touch with pressure of 0.1-0.3 MPa can achieve the most effective printing result. Speculative information reveal that when the scrape angle boosts from 45 \u00b0 to 60 \u00b0, the solder paste transfer performance rises by 12%, but too large will create enhanced side burrs.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"scraper-speed-control-strategy\">Scraper speed control strategy<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Select scraper rate (20-80mm\/ s) according to solder paste thickness:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>High viscosity solder paste\u00a0<\/strong>(&gt; 100Pa \u00b7 s): recommended rate 30-50mm\/ s.-\u00a0<strong>Low thickness solder paste\u00a0<\/strong>(50-80Pa \u00b7 s): can be enhanced to 60-80mm\/ s. Too fast rate will certainly bring about not enough solder paste filling up, also sluggish speed may create tailing sensation.<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"h2-steel-plate-upkeep-and-cleansing-specifications-\">Steel plate upkeep and cleansing specifications.<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"cleansing-frequency-control-standard-\">Cleansing frequency control standard.<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Ordinary items\u00a0<\/strong>: Tidy once every 100-200 printed motherboard.<\/li>\n\n\n\n<li><strong>High-density PCB\u00a0<\/strong>: It is advised to clean when every 50 boards.<\/li>\n\n\n\n<li><strong>Ultra-fine pitch components\u00a0<\/strong>: Usage online automated cleaning system (OCS).<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"contrast-of-cleansing-techniques-\">Contrast of cleansing techniques.<\/h3>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Metodo<\/th><th>Cleansing performance<\/th><th>Appropriate circumstances<\/th><\/tr><\/thead><tbody><tr><td>Wipe with dust-free towel<\/td><td>70%<\/td><td>Daily maintenance<\/td><\/tr><tr><td>Ultrasonic cleaning<\/td><td>95%<\/td><td>High-precision steel plate<\/td><\/tr><tr><td>Compressed air cleanup<\/td><td>85%<\/td><td>Quick chip removal<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">Normal use acetone + alcohol mixed solvent (proportion 3:1) for deep cleansing can efficiently eliminate oxidation residues. It is advised to examine the density of the steel plate when a month, and replace it immediately if the wear exceeds 0.02 mm.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"h2-influence-of-environmental-control-on-printing-high-quality-\">Influence of environmental control on printing high quality.<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"temperature-and-humidity-control-criteria-\">Temperature and humidity control criteria.<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Temperature\u00a0<\/strong>: 20-25 \u2103 ( \u00b1 2 \u2103) . \u2013<strong>\u00a0Moisture\u00a0<\/strong>: 40-60% RH ( \u00b1 5%) . Under extreme problems, the viscosity of solder paste can rise and fall by approximately 20%, which directly impacts the precision of printed graphics. It is recommended to configure a constant temperature and moisture system in the printing workshop and calibrate the temperature level and moisture sensors on a regular basis.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"vibration-suppression-steps-\">Vibration suppression steps.<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Mount a vibration damping table (damping coefficient &gt; 0.7).<\/li>\n\n\n\n<li>Use a vacuum cleaner adsorption workbench.<\/li>\n\n\n\n<li>The range between the printer and nearby equipment is \u2265 1.5 meters.<\/li>\n<\/ul>\n\n\n\n<figure class=\"wp-block-image size-full\"><img decoding=\"async\" width=\"800\" height=\"800\" src=\"https:\/\/sevenpcba.com\/wp-content\/uploads\/2025\/05\/Comparison-of-PCB-before-and-after-AOI-inspection.jpg\" alt=\"\" class=\"wp-image-3055\" srcset=\"https:\/\/sevenpcba.com\/wp-content\/uploads\/2025\/05\/Comparison-of-PCB-before-and-after-AOI-inspection.jpg 800w, https:\/\/sevenpcba.com\/wp-content\/uploads\/2025\/05\/Comparison-of-PCB-before-and-after-AOI-inspection-768x768.jpg 768w, https:\/\/sevenpcba.com\/wp-content\/uploads\/2025\/05\/Comparison-of-PCB-before-and-after-AOI-inspection-12x12.jpg 12w\" sizes=\"(max-width: 800px) 100vw, 800px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"h2-analysis-and-services-for-usual-issues-\">Analysis and services for usual issues.<\/h2>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Problem kind<\/th><th>Create<\/th><th>Remedy<\/th><\/tr><\/thead><tbody><tr><td>Solder brief circuit<\/td><td>Way too much solder paste\/improper opening up style<\/td><td>Maximize opening up size\/adjust scrape pressure<\/td><\/tr><tr><td>Empty solder<\/td><td>Insufficient solder paste transfer\/oxidation residue<\/td><td>Rise steel plate cleaning frequency\/preheating treatment<\/td><\/tr><tr><td>Draw pointer<\/td><td>Too rapid demoulding speed\/too reduced solder paste thickness<\/td><td>Lower demoulding speed to 5-10mm\/ s<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"h2-key-modern-technologies-for-steel-plate-opening-up-layout-\">Key modern technologies for steel plate opening up layout.<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"opening-up-form-optimization-\">Opening up form optimization.<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Rectangular opening\u00a0<\/strong>: Suitable to standard QFP devices.<\/li>\n\n\n\n<li><strong>Trapezoidal opening\u00a0<\/strong>: Boost solder paste launch of BGA tools.<\/li>\n\n\n\n<li><strong>Upside down trapezoidal opening\u00a0<\/strong>: Designed for 0.4 mm pitch CSP.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"opening-size-computation-formula-\">Opening size computation formula.<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">$$ A = S \\ times (1 \u2013 0.15) $$. Where A is the opening area, S is the pad area. For 0.3 mm pitch BGA, the advised opening size = pad width \u00d7 0.92.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"h2-solder-paste-detection-modern-technology-prior-to-reflow-soldering-\">Solder paste detection modern technology prior to reflow soldering.<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"3d-spi-discovery-parameters-\">3D SPI discovery parameters.<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Quantity resistance\u00a0<\/strong>: \u00b1 5%.<\/li>\n\n\n\n<li><strong>Height discrepancy\u00a0<\/strong>: \u2264 50\u03bcm.<\/li>\n\n\n\n<li><strong>Placement offset\u00a0<\/strong>:<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"online-detection-system-arrangement\">Online detection system arrangement<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>X-ray detection\u00a0<\/strong>: Suitable to covert solder joints such as BGA\/CSP<\/li>\n\n\n\n<li><strong>2D optical detection\u00a0<\/strong>: Identify printing honesty<\/li>\n\n\n\n<li><strong>3D imaging\u00a0<\/strong>: Action solder paste quantity and elevation<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"h2-expense-control-and-performance-enhancement-approach\">Expense control and performance enhancement approach<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"tools-financial-investment-return-evaluation\">Tools financial investment return evaluation<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Fully automatic tools\u00a0<\/strong>: Financial investment healing period is about 18 months (yearly manufacturing of 100,000 PCBs).<\/li>\n\n\n\n<li><strong>Semi-automatic equipment\u00a0<\/strong>: Payback period is shortened to one year (yearly manufacturing of 30,000 items).<\/li>\n\n\n\n<li><strong>Handbook printing\u00a0<\/strong>: Only applicable to situations with annual production of &lt;5,000 pieces<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"process-optimization-suggestions\">Process optimization suggestions<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Use tipped scraper stress (front end 0.25 MPa, rear end 0.15 MPa).<\/li>\n\n\n\n<li>Implement steel plate life management (suggested use times \u2264 5000 times).<\/li>\n\n\n\n<li>Establish an on-line monitoring system for solder paste thickness.<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"h2-sector-advancement-patterns-and-technical-technology-\">Sector advancement patterns and technical technology.<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"application-of-brand-new-materials-\">Application of brand-new materials.<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Nano solder paste\u00a0<\/strong>: particle size &lt;5\u03bcm, improve 0.2mm spacing printing accuracy<\/li>\n\n\n\n<li><strong>Low-temperature solder paste\u00a0<\/strong>: melting point minimized to 138 \u2103, appropriate for delicate elements<\/li>\n<\/ul>\n\n\n\n<div class=\"wp-block-buttons is-content-justification-center is-layout-flex wp-container-core-buttons-is-layout-fe0a7de2 wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button\"><a class=\"wp-block-button__link wp-element-button\" href=\"https:\/\/sevenpcba.com\/it\/contact\/\">Richiedi subito un preventivo gratuito per l&#039;assemblaggio di PCB <\/a><\/div>\n<\/div>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"digital-change\">Digital change<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>AI aesthetic system realizes adaptive change of printing parameters<\/li>\n\n\n\n<li>Digital twin technology replicates printing results under various procedure conditions<\/li>\n\n\n\n<li>Big information evaluation maximizes steel plate wear forecast design<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"faq\">Domande frequenti<\/h2>\n\n\n<div id=\"rank-math-faq\" class=\"rank-math-block\">\n<div class=\"rank-math-list\">\n<div id=\"faq-question-1751704853374\" class=\"rank-math-list-item\">\n<h3 class=\"rank-math-question\"><strong>Just how to determine whether the solder paste is void?<\/strong><\/h3>\n<div class=\"rank-math-answer\">\n\n<p>Observe whether the solder paste is crusted, whether the color ends up being darker, and whether the thickness is uncommon. It is recommended to save it in a fridge at 2-8 \u2103 after opening up, and the service life will not go beyond 8 hours.<\/p>\n\n<\/div>\n<\/div>\n<div id=\"faq-question-1751704854251\" class=\"rank-math-list-item\">\n<h3 class=\"rank-math-question\"><strong>Exactly how to discover scrape wear?\u00a0<\/strong><\/h3>\n<div class=\"rank-math-answer\">\n\n<p>Use a digital caliper to gauge the angle modification of the scrape blade. If the wear exceeds 5 \u00b0, it requires to be changed right away. Examine frequently whether there is any residual solder paste on the back of the scraper.<\/p>\n\n<\/div>\n<\/div>\n<div id=\"faq-question-1751704854986\" class=\"rank-math-list-item\">\n<h3 class=\"rank-math-question\"><strong>Which parameter should be adjusted first when printing is bad?<\/strong><\/h3>\n<div class=\"rank-math-answer\">\n\n<p>It is advised to adjust in order: scraper pressure \u2192 angle \u2192 speed \u2192 demolding rate. Only adjust one criterion at a time to avoid shared disturbance.<\/p>\n\n<\/div>\n<\/div>\n<div id=\"faq-question-1751704855787\" class=\"rank-math-list-item\">\n<h3 class=\"rank-math-question\"><strong>Just how to select the density of the steel plate?<\/strong><\/h3>\n<div class=\"rank-math-answer\">\n\n<p>Adhere to the concept of 0.15 \u00d7 minimum pad spacing. As an example, for a 0.5 mm spacing BGA, a 0.12 mm thick steel plate is advised.<\/p>\n\n<\/div>\n<\/div>\n<div id=\"faq-question-1751704856523\" class=\"rank-math-list-item\">\n<h3 class=\"rank-math-question\"><strong>What is the function of the vacuum adsorption workbench?<\/strong><\/h3>\n<div class=\"rank-math-answer\">\n\n<p>Eliminate circuit board deformation, make certain that the board surface area and the steel plate are fully fitted during printing, and reduce the risk of offset and brief circuit.<\/p>\n\n<\/div>\n<\/div>\n<div id=\"faq-question-1751704859107\" class=\"rank-math-list-item\">\n<h3 class=\"rank-math-question\"><strong>Why do you require to pre-heat after solder paste printing?\u00a0<\/strong><\/h3>\n<div class=\"rank-math-answer\">\n\n<p>Pre-heating can make the change evaporate evenly and enhance the moistening performance during reflow soldering. The suggested pre-heating temperature level is 80-120 \u2103 and the time is 1-2 mins.<\/p>\n\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\" id=\"conclusion\">Conclusione<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">The high quality of solder paste printing directly impacts the reliability of electronic items, and needs organized monitoring from material option, tools setup, procedure specifications to environmental control. By maximizing steel plate style, carrying out refined procedure control, and embracing advanced discovery innovation, the printing flaw price can be managed below 50PPM, significantly boosting item yield and market competition.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><\/p>","protected":false},"excerpt":{"rendered":"<p>Introduction In the field of digital production, solder paste printing is the core web link of surface place modern technology (SMT). This short article systematically evaluates the principle of solder paste printing procedure, equipment category and quality control points, and provides practical recommendation for digital manufacturing experts. Via scientific evaluation of printing parameters and process [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":3961,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[1],"tags":[],"class_list":["post-3960","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog"],"acf":[],"_links":{"self":[{"href":"https:\/\/sevenpcba.com\/it\/wp-json\/wp\/v2\/posts\/3960","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/sevenpcba.com\/it\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/sevenpcba.com\/it\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/sevenpcba.com\/it\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/sevenpcba.com\/it\/wp-json\/wp\/v2\/comments?post=3960"}],"version-history":[{"count":1,"href":"https:\/\/sevenpcba.com\/it\/wp-json\/wp\/v2\/posts\/3960\/revisions"}],"predecessor-version":[{"id":3963,"href":"https:\/\/sevenpcba.com\/it\/wp-json\/wp\/v2\/posts\/3960\/revisions\/3963"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/sevenpcba.com\/it\/wp-json\/wp\/v2\/media\/3961"}],"wp:attachment":[{"href":"https:\/\/sevenpcba.com\/it\/wp-json\/wp\/v2\/media?parent=3960"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/sevenpcba.com\/it\/wp-json\/wp\/v2\/categories?post=3960"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/sevenpcba.com\/it\/wp-json\/wp\/v2\/tags?post=3960"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}