SMT Assembly

we are a UL  certified factory with 13 years experance  ,we are fouce on increase SMT succeed rate,we can find the problem and know how to solve the problem ,Here is 10 Comment Error in Surface mount Technology (SMT)

The following are the top 10 common errors and high conversion rate solutions for SMT Assembly.

1.Poor soldering (false soldering/short circuit) 

Solution: optimize the reflow soldering temperature curve, use highly active solder paste, and calibrate the steel mesh thickness.

2.Component lift 

Solution: balance the pad thermal capacity design and enable solder paste anti-offset printing technology.

3.Solder ball/solder ball residue 

Solution: reduce the heating rate of the preheating zone and increase the cleaning frequency of the bottom of the steel mesh.

4.BGA tinning/false soldering 

Solution: X-Ray layer detection, adjust the reflow soldering pressure and temperature gradient.

5.Component offset (mounting misalignment)

Solution: calibrate the nozzle accuracy of the placement machine and enable the visual alignment compensation system.

6.PCB oxidation/contamination

Solution: store PCB in nitrogen and add plasma cleaning process.

7.Uneven solder paste printing (little tin/missing printing)

Solution: replace the laser steel mesh and adjust the scraper pressure and demolding speed.

8.Component falling off (mechanical stress)

Solution: Optimize the Z-axis pressure of mounting and use the red glue process with low voiding rate.

9.Cold soldering (dull solder joints)

Solution: Extend the constant temperature zone time and upgrade the multi-temperature zone reflow soldering equipment.

10.Solder paste collapse (bridging risk)

Solution: Use anti-collapse solder paste formula to shorten the furnace time after printing.